目 錄 序 前言 第 1 章 微弧氧化技術(shù)概論 ·············································································· 1 1.1 微弧氧化技術(shù)簡(jiǎn)介 ············································································· 1 1.1.1 微弧氧化技術(shù)定義 ········································································· 1 1.1.2 微弧氧化技術(shù)特點(diǎn) ········································································· 1 1.1.3 微弧氧化與陽(yáng)極氧化對(duì)比 ································································ 2 1.2 微弧氧化技術(shù)的產(chǎn)生與發(fā)展 ······························································· 3 1.3 微弧氧化技術(shù)的應(yīng)用·········································································· 5 1.4 微弧氧化技術(shù)面臨的挑戰(zhàn)與未來(lái)發(fā)展方向 ·········································· 6 1.4.1 面臨的挑戰(zhàn) ·················································································· 6 1.4.2 未來(lái)發(fā)展方向 ··············································································· 8 參考文獻(xiàn) ··································································································· 8 第 2 章 微弧氧化涂層形成過(guò)程與機(jī)理··························································· 10 2.1 概述 ································································································ 10 2.2 微弧氧化涂層生長(zhǎng)過(guò)程與機(jī)理模型··················································· 10 2.2.1 微弧氧化生長(zhǎng)過(guò)程 ······································································· 12 2.2.2 涂層生長(zhǎng)規(guī)律和等離子體放電模型 ·················································· 13 2.2.3 涂層的組織結(jié)構(gòu)形成與特點(diǎn) ··························································· 15 2.2.4 擊穿-反應(yīng)-熔凝效應(yīng)與涂層形成機(jī)制模型 ·········································· 19 2.3 微弧氧化涂層生長(zhǎng)過(guò)程中的陰極放電 ··············································· 22 2.4 微弧氧化涂層生長(zhǎng)過(guò)程中的氣體演化 ··············································· 23 2.4.1 電解液與電參數(shù)對(duì)氣體演化的影響 ·················································· 24 2.4.2 氫氣釋放對(duì)涂層生長(zhǎng)的影響 ··························································· 25 2.5 微弧氧化涂層生長(zhǎng)過(guò)程中的能量損耗與控制····································· 25 2.6 本章小結(jié)與未來(lái)發(fā)展方向································································· 26 參考文獻(xiàn) ································································································· 26· vi· 微弧氧化原理與功能涂層設(shè)計(jì)及應(yīng)用 第 3 章 微弧氧化涂層基本特征 ····································································· 28 3.1 概述 ································································································ 28 3.2 涂層多微孔性與微孔可控性 ····························································· 28 3.2.1 涂層多微孔性 ············································································· 28 3.2.2 微孔結(jié)構(gòu)特征 ············································································· 30 3.2.3 涂層微孔可控性 ·········································································· 30 3.3 涂層的高硬度/高彈性模量 ································································ 31 3.3.1 維氏硬度 ··················································································· 31 3.3.2 納米硬度與彈性模量 ···································································· 33 3.4 涂層膜基界面高的結(jié)合強(qiáng)度 ····························································· 35 3.5 涂層內(nèi)的壓應(yīng)力特性········································································ 36 3.6 涂層界面“過(guò)生長(zhǎng)”特性及對(duì)力學(xué)衰減的影響 ····································· 37 3.7 涂層界面拉應(yīng)力特性誘導(dǎo)疲勞壽命衰減及改進(jìn)措施 ·························· 39 3.8 本章小結(jié)與未來(lái)發(fā)展方向································································· 41 第 4 章 工藝參數(shù)與涂層優(yōu)化策略·································································· 42 4.1 概述 ································································································ 42 4.2 電源輸出模式與涂層優(yōu)化································································· 42 4.3 微弧氧化放電過(guò)程控制與涂層優(yōu)化··················································· 46 4.4 電參數(shù)調(diào)控制度與涂層優(yōu)化 ····························································· 46 4.5 “軟火花”放電制度與涂層優(yōu)化 ·························································· 49 4.5.1 脈沖頻率對(duì)陰極放電的影響與涂層優(yōu)化 ············································ 49 4.5.2 “軟火花”放電條件形成與涂層優(yōu)化··················································· 51 4.6 電解液影響與涂層優(yōu)化 ···································································· 52 4.6.1 電解液的作用及分類 ···································································· 52 4.6.2 基礎(chǔ)電解液體系與涂層優(yōu)化 ··························································· 54 4.6.3 特殊離子/粒子添加的電解液體系與涂層優(yōu)化 ····································· 56 4.6.4 自封孔涂層的電解液體系與涂層優(yōu)化 ··············································· 59 4.6.5 非水電解液體系與涂層優(yōu)化 ··························································· 61 4.7 金屬成分影響與涂層優(yōu)化································································· 63 4.7.1 金屬發(fā)生微弧氧化反應(yīng)難易程度與熱力學(xué)解釋 ··································· 63 4.7.2 金屬合金成分對(duì)涂層生長(zhǎng)的影響 ····················································· 64 4.7.3 不同冶金狀態(tài)的基體對(duì)涂層生長(zhǎng)的影響 ············································ 68目 錄 · vii· 4.7.4 金屬基復(fù)合材料對(duì)涂層生長(zhǎng)的影響 ·················································· 69 4.7.5 高熵合金對(duì)涂層生長(zhǎng)的影響 ··························································· 71 4.8 本章小結(jié)與未來(lái)發(fā)展